Protected alloy surfaces in microchannel apparatus and catalysts, alumina supported catalysts, catalyst intermediates, and methods of forming catalysts and microchannel apparatus

ABSTRACT

The invention describes microchannel apparatus and catalysts that contain a layer of a metal aluminide or are made in a process in which a metal aluminide layer is formed as an intermediate. Certain processing conditions have surprisingly been found to result in superior coatings. The invention includes chemical processes conducted through apparatus described in the specification. Other catalysts and catalyst synthesis techniques are also described.

RELATED APPLICATIONS

In accordance with 35 U.S.C. sect. 119(e), this application claimspriority to U.S. Provisional Application No. 60/556,014, filed Mar. 23,2004.

FIELD OF THE INVENTION

This invention relates to microchannel apparatus, catalysts and methodsof making same. The invention also relates to chemical reactions andmicrochannel chemical reactors.

INTRODUCTION

In recent years there has been tremendous academic and commercialinterest in microchannel devices. This interest has arisen due to theadvantages from microtechnology including reduced size, increasedproductivity, the ability to size systems of any desired capacity (i.e.,“number-up”), increased heat transfer, and increased mass transfer. Areview of some of the work involving microreactors (a subset ofmicrochannel apparatus) has been provided by Gavrilidis et al.,“Technology And Applications Of Microengineered Reactors,” Trans.IChemE, Vol. 80, Part A, pp. 3-30 (January 2002).

Microchannel apparatus can be made of a variety of materials includingceramics, plastics, and metals. In many applications, process channelsin microchannel apparatus require a coating or coatings over thestructural material. The coatings can serve purposes such as absorption,adsorption, corrosion protection, surface wettability for tailoredmicro-fluidics and catalysis. In some cases, microchannels are slurrycoated or sol coated; for example, an oxide coat applied to a ceramichoneycomb. In some cases, sheets of a material are coated and thenassembled and bonded to form a multilayer microchannel device.

Since one focus of the present invention includes aluminide coatings,reference can be made to early work described by LaCroix in U.S. Pat.No. 3,944,505. This patent describes a catalytic device made of a stackof expanded metal sheets (such as Inconel). The metal sheets carry alayer of a nickel or cobalt aluminide and a layer of alpha alumina onthe aluminide, and a catalytic surface on the aluminide. LaCroix did notdescribe how the aluminide layer was formed on the sheets, nor didLaCroix provide any data describing the aluminide layer.

Methods of forming aluminide coatings are well known and have beenutilized commercially for coating certain jet engine parts. Methods ofmaking aluminide coatings from aluminum halides are described in, forexample, U.S. Pat. Nos. 3,486,927 and 6,332,926.

There have been attempts to apply aluminide coatings on interiorchannels of gas turbine airfoils. Rigney et al. in U.S. Pat. No.6,283,714 reported coating internal cooling passages of turbine bladeswith an aluminum coating using a slurry/pack process. Rigney et al. alsostated that an aluminum halide gas could be passed through the coolingpassages at high temperature so that an aluminum coating about 0.002inch (50 μm) thick may be deposited in about 4 to 8 hours. Pfaendter etal. in U.S. Pat. No. 6,332,926 also suggests flowing an aluminum-coatingprecursor to deposit aluminum onto an internal airfoil surface.

Howard et al. in U.S. Pat. No. 5,928,725 entitled “Method and Apparatusfor Gas Phase Coating Complex Internal Surfaces of Hollow Articles,”reviewed prior art methods of gas phase coating for coating internalsurfaces but remarked that the prior art methods were ineffective forcoating multiple gas passages of modern airfoils and result innon-uniform internal coatings. In the process described in this patent,the coating gas flow rate is controlled to a different rate into atleast two channels. Howard et al. state that a coating mixture includingaluminum powder, aluminum oxide and aluminum flouride could be heated todeliver a coating gas. This improved method was reported to result in analuminide coating thickness of 1.5 mils±1.0 mil.

As described below, the present invention provides novel microchannelapparatus having improved coatings and methods of making improvedcoatings. The invention also includes methods of conducting unitoperations through microchannel devices with coated microchannels.

SUMMARY OF THE INVENTION

In a first aspect, the invention provides a microchannel reactor orseparator, comprising: a complex microchannel defined by at least onemicrochannel wall; and a layer of aluminide disposed over the at leastone microchannel wall. In this aspect as well as the next aspect, it isimportant to recognize the character of the invention as a reactor orseparator—these functions are integral to the definition of theinvention. Preferably the reactor or separator further comprises a layerof alumina disposed over the layer of aluminide; and a catalyticmaterial disposed over the layer of alumina. The reactor or separatormay include a manifold that is connected to at least two microchannels,wherein the manifold comprises a manifold wall that is coated with analuminide layer. In a preferred embodiment, the reactor or separator ismade by laminating together sheets and the layer of aluminide is apost-assembly coating. As with all aspects of the invention, theinvention can be further described in conjunction with any details fromthe Detailed Description. Furthermore, as with all aspects of theinvention, the invention includes methods of making the apparatus andmethods of conducting a chemical process in the apparatus. For example,the invention includes a method of conducting a chemical reaction orseparating a mixture comprising at least two components in theabove-described reactor or separator, comprising either:

-   -   (a) wherein the reactor or separator is a reactor and the        reactor further comprises a layer of alumina disposed over the        layer of aluminide; and a catalytic material disposed over the        layer of alumina, and comprising a step of passing a reactant        into the complex microchannel and reacting the reactant in the        complex microchannel to form at least one product; or    -   (b) wherein the reactor or separator is a separator and        comprising a step of passing a fluid comprising at least two        components into the complex microchannel, preferentially        separating at least one of the at least two components within        the complex microchannel.

In another aspect, the invention provides a microchannel reactor orseparator, comprising: a microchannel defined by at least onemicrochannel wall; and a post-assembly coating of aluminide disposedover the at least one microchannel wall. Preferably, the microchannelreactor or separator of claim B, further comprises a layer aluminadisposed over the layer of aluminide; and a catalytic material disposedover the layer of alumina. Again, by way of example, the inventionincludes methods of making the apparatus (such as by applying apost-assembly coating) and a method of conducting a chemical reaction orseparating a mixture comprising at least two components in theabove-described reactor or separator, comprising either:

-   -   (a) wherein the reactor or separator is a reactor and the        reactor further comprises a layer of alumina disposed over the        post-assembly layer of aluminide; and a catalytic material        disposed over the layer of alumina, and comprising a step of        passing a reactant into the complex microchannel and reacting        the reactant in the complex microchannel to form at least one        product; or    -   (b) wherein the reactor or separator is a separator and        comprising a step of passing a fluid comprising at least two        components into the microchannel, preferentially separating at        least one of the at least two components within the complex        microchannel.

In a further aspect, the invention provides a catalyst or catalystprecursor, comprising: a substrate; an aluminide coating disposed overthe substrate; an alumina layer disposed over the aluminide coating,wherein the alumina layer comprises at least 0.1 wt % of a rare earthelement or sintering aid; and a catalyst material disposed on thealumina layer. Likewise, the invention includes a method of making thiscatalyst or catalyst precursor and methods of conducting chemicalreactions over the catalyst. It may be observed that a “substrate” canbe any catalyst support including a microchannel wall such as in amicrochannel reactor.

In another aspect, the invention provides a method of making a catalyst,comprising: depositing aluminide on a substrate; oxidizing the surfaceof the aluminide layer to form alumina needles; and depositing acatalyst material onto the alumina needles.

In yet another aspect, the invention provides a method of making acoated structure, comprising: depositing aluminide on a substrate;exposing the aluminide to an oxidizing agent to form an alumina layer;depositing a sintering aid on the alumina layer to form an article withan alumina layer with sintering aid; and heating the article with analumina layer with sintering aid.

In a further aspect, the invention provides a method of forming acatalyst, comprising: adding a sintering aid to alumina to form anarticle with an alumina layer with sintering aid; and heating thearticle with an alumina layer with sintering aid; and subsequentlydepositing a catalyst material.

In another aspect, the invention provides a method of forming amicrochannel reactor comprising any of the above methods of forming acatalyst. For example, coatings can be applied to a microchannel wall orto an insert that is added to or disposed in a reaction microchannel.

In a further aspect, the invention provides microchannel apparatus,comprising: at least two parallel microchannels, each of which iscontiguous for at least 1 cm; a manifold connecting the at least twomicrochannels; wherein the manifold comprises an aluminide coating.

In another aspect, the invention provides a method of forming protectedsurfaces, comprising: providing an article comprising an aluminidesurface; heating the article comprising an aluminide surface to at leastabout 800° C. in an inert or reducing atmosphere; and exposing thealuminde surface to an oxidizing gas at a temperature of at least about800° C., preferably at least about 1000° C. and more preferably in therange of about 1000 to 1100° C., to grow an oxide layer.

In still another aspect, the invention provides a method of makingmicrochannel apparatus, comprising: placing an insert into an interiormicrochannel; and forming an aluminide inside the channel and creating ametallic bond between the insert and a microchannel wall.

Many aspects of the present invention include passage of gaseousaluminum compounds over metal surfaces (especially a metal wall of amicrochannel) and simultaneously or subsequently reacting with a metalin the substrate to form a surface layer of metal aluminide—this processis termed aluminization, perhaps more accurately, aluminidization.Conditions for aluminidization are conventionally known for jet engineparts, and the conventional steps are not described here. Certain stepssuch as excluding oxygen, controlling flow, and passage throughmanifolds are discussed in greater detail below.

In one aspect, the invention provides a method of forming a catalystthat comprises the steps of: (1) depositing a layer of Al, (2) forming alayer of metal aluminide on a metal alloy; (3) oxidizing the metalaluminide to form an alumina scale (in some embodiments this scale is inthe form of alumina needles); (4) optionally modifying the scale (a) byan acid or base etch, and/or adding a rare earth salt to form a rareearth-modified alumina, and/or (c) adding sintering aids; (5) optionallycoating with a metal oxide sol (or metal oxide slurry); and (6) adding acatalyst metal (typically by impregnation). Preferably the metal oxidesol or slurry is an alumina sol (here, alumina sol means a sol thatafter being deposited and heated, forms alumina) or alumina slurry. Theinvention also includes each of the individual steps or any combinationthereof. For example, steps (1) and (2), deposition of Al and formationof a metal aluminide can be accomplished in a single step. As anotherexample, in one preferred aspect, the invention comprises a method offorming a catalyst comprising a step of adding sintering aids onto analumina support (which may be pellets or an alumina layer on asubstrate). In another example, steps (5) and (6), coating with acatalyst precursor sol, and addition of a catalyst metal, can beincorporated into a single step. In another embodiment the metal alloycan be pre-coated with a catalytically active metal before thedeposition of the surface aluminum layer in step (1). The invention alsoincludes the catalysts and catalyst intermediates formed by thedisclosed methods. The invention further includes microchannel apparatusthat is treated by any of the inventive methods; for example, theinvention includes microchannel apparatus that comprises a layer of anickel aluminide, or an apparatus that is made by oxidizing a nickelaluminide followed by applying an alumina wash coat. The invention alsoincludes the optional coating of pipes, tubes, or other structuresattached to the microchannel reactor.

The invention also includes methods for catalytic chemical conversion,such method comprising flowing a reactant fluid composition into amicrochannel, wherein a catalyst composition is present in themicrochannel (on a microchannel wall or elsewhere within themicrochannel), and reacting the reactant fluid composition to form adesired product (or products) in the microchannel. The invention furtherincludes methods for catalytic chemical conversion comprising contactingat least one reactant with an inventive catalyst.

Various embodiments of the invention can provide various advantages. Analuminide layer serves as an aluminum reservoir for self healing ifthere is any damage to the overlying alumina layer. The aluminide layermay also reduce coke formation (in processes susceptible to cokeformation) and reduce metal dusting. The corrosive power of a chemicalreaction often depends on both the temperature and the chemical natureof the fluid to be processed. Alumina is both thermally and chemicallystable, and thus superior to many other materials.

Glossary of Terms Used

“Metal aluminide” refers to a metallic material containing 10% or moreMetal and 5%, more preferably 10%, or greater Aluminum (Al) with the sumof Metal and Al being 50% or more. These percentages refer to masspercents. Preferably, a metal aluminide contains 50% or more Metal and10% or greater Al with the sum of Ni and Al being 80% or more. Inembodiments in which Metal and Al have undergone significant thermaldiffusion, it is expected that the the composition of a Metal-Al layerwill vary gradually as a function of thickness so that there may not bea distinct line separating the Metal-Al layer from an underlyingMetal-containing alloy substrate. The term “aluminide” is usedsynonamously with metal aluminide. A phase diagram of the NiAl system isshown in FIG. 2 of U.S. Pat. No. 5,716,720.

A preferred metal aluminide is nickel aluminide (NiAl). “Nickelaluminide” refers to a material containing 10% or more Ni and 10% orgreater Al with the sum of Ni and Al being 50% or more. Thesepercentages refer to mass percents. Preferably, a nickel aluminidecontains 20% or more Ni and 10% or greater Al with the sum of Ni and Albeing 80% or more. In embodiments in which Ni and Al have undergonesignificant thermal diffusion, it is expected that the the compositionof a Ni—Al layer will vary gradually as a function of thickness so thatthere may not be a distinct line separating the Ni—Al layer from anunderlying Ni-based alloy substrate.

A “catalyst material” is a material that catalyzes a desired reaction.It is not alumina. A catalyst material “disposed over” a layer can be aphysically separate layer (such as a sol-deposited layer) or a catalystmaterial disposed within a porous, catalyst support layer. “Disposedonto” or “disposed over” mean directly on or indirectly on withintervening layers. In some preferred embodiments, the catalyst materialis directly on a thermally-grown alumina layer.

A “catalyst metal” is the preferred catalyst material and is a materialin metallic form that catalyzes a desired reaction. Catalyst metals canexist as fully reduced metals, or as mixtures of metal and metal oxides,depending on the conditions of treatment. Particularly preferredcatalyst metals are Pd, Rh and Pt.

A “complex microchannel” is in apparatus that includes one or more ofthe following characteristics: at least one contiguous microchannel hasa turn of at least 45°, in some embodiments at least 90°, in someembodiments a u-bend; a length of 50 cm or more, or a length of 20 cm ormore along with a dimension of 2 mm or less, and in some embodiments alength of 50-500 cm; at least one microchannel that splits into at least2 sub-microchannels in parallel, in some embodiments 2 to 4 sub-channelsin parallel; at least 2 adjacent channels, having an adjacent length ofat least one cm that are connected by plural orifices along a commonmicrochannel wall where the area of orifices amounts to 20% or less ofthe area of the microchannel wall in which the orifices are located andwhere each orifice is 1.0 mm² or smaller, in some embodiments 0.6 mm² orsmaller, in some embodiments 0.1 mm² or smaller—this is a particularlychallenging configuration because a coating should be applied withoutclogging the holes; or at least two, in some embodiments at least 5,parallel microchannels having a length of at least 1 cm, have openingsto an integral manifold, where the manifold includes at least onedimension that is no more than three times the minimum dimension of theparallel microchannels (for example, if one of the parallelmicrochannels had a height of 1 mm (as the smallest dimension in the setof parallel microchannels), then the manifold would possess a height ofno more than 3 mm). An integral manifold is part of the assembled deviceand is not a connecting tube. A complex microchannel is one type ofinterior microchannel.

A “contiguous microchannel” is a microchannel enclosed by a microchannelwall or walls without substantial breaks or openings—meaning thatopenings (if present) amount to no more than 20% (in some embodiments nomore than 5%, and in some embodiments without any openings) of the areaof the microchannel wall or walls on which the opening(s) are present.

An “interior microchannel” is a microchannel within a device that issurrounded on all sides by a microchannel wall or walls except forinlets and outlets, and, optionally, connecting holes along the lengthof a microchannel such as a porous partition or orifices such asconnecting orifices between a fuel channel and an oxidant channel. Sinceit is surrounded by walls, it is not accessible by conventionallithography, conventional physical vapor deposition, or other surfacecoating techniques with line-of-sight limitation.

An “insert” is a component that can be inserted into a channel eitherbefore or after assembly of the apparatus.

A “manifold” is a header or footer that connects plural microchannelsand is integral with the apparatus.

“Ni-based” alloys are those alloys comprising at least 30%, prefearblyat least 45% Ni, more preferably at least 50% (by mass). In somepreferred embodiments, these alloys also contain at least 5%, preferablyat least 10% Cr.

A “post-assembly” coating is applied onto three dimensional microchannelapparatus. This is either after a laminating step in a multilayer devicemade by laminating sheets or after manufacture of a manufacturedmulti-level apparatus such as an apparatus in which microchannels aredrilled into a block. This “post-assembly” coating can be contrastedwith apparatus made by processes in which sheets are coated and thenassembled and bonded or apparatus made by coating a sheet and thenexpanding the sheet to make a three-dimensional structure. For example,a coated sheet that is then expanded may have uncoated slit edges.Uncoated surfaces of all types, such as slit edges, can undergocorrosion or reaction under reaction conditions. Thus, it isadvantageous to coat the device after assembly to protect all of theinternal surface against corrosion. The post-assembly coating providesadvantages such as crack-filling and ease of manufacture. Additionally,the aluminide or other coating could interfere with diffusion bonding ofa stack of coated sheets and result in an inferior bond since aluminideis not an ideal material for bonding a laminated device and may notsatisfy mechanical requirements at high temperature. Whether anapparatus is made by a post-assembly coating is detectable by observablecharacteristics such as gap-filling, crack-filling, elemental analysis(for example, elemental composition of sheet surfaces versus bondedareas) Typically, these characterisitics are observed by opticalmicroscopy, electron microscopy or electron microscopy in conjunctionwith elemental analysis. Thus, for a given apparatus, there is adifference between pre-assembled and post-assembled coated devices, andan analysis using well-known analytical techniques can establish whethera coating was applied before or after assembly (or manufacture in thecase of drilled microchannels) of the microchannel device.

A “separator” is a type of chemical processing apparatus that is capableof separating a component or components from a fluid. For example, adevice containing an adsorbent, distillation or reactive distillationapparatus, etc.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a simplified view of a microreactor with a set of reactionmicrochannels in a cross-flow relationship with a set of coolingmicrochannels.

FIG. 2 is a scanning electron microphotograph of theta (Θ) aluminawhiskers grown from NiAl.

FIG. 3 is a photograph of a cut-open, microchannel device showing analuminidized channel surface. This surface was on the side of amicrochannel that was opposite a side having orifices (jets) andaluminizing gas flowed through these orifices and impacted the surface,causing jet impingment defects.

FIG. 4 shows SEM micrographs of an alumina disk that was treated with aLi—Na—B solution and heat treated at 900° C. for one hour. After coolingto room temperature, alumina powder was sprinkled onto the surface ofthe coated area and the disk was reheated at 900° C. for one hour. A—anuncoated area of the disk. B—coated area of disk. C, D—coated area wherepowder was applied. In B, C and D, the sintering aid solution reactedwith the alumina to create a glassy phase at the grain boundaries andalso bonded alumina powders to the substrate.

FIG. 5 is a schematic illustration of an aluminide coated substrate.

FIG. 6 is a SEM micrograph of an alumina surface after corrosion testingexposed to an atmosphere of 17% H2O, 2.5% O2, 23% CO2, balance N2, for1000 hours at 960° C.

FIG. 7 is a partly exploded view of a multichannel, microchannel devicein which the internal microchannels were coated with aluminide.

FIGS. 8 and 9 are cross-sectional SEM micrographs of aluminidizedchannels within the device of FIG. 7.

FIG. 10 a shows a cross-sectional SEM micrograph of an aluminidizedcorner within a microchannel.

FIG. 10 b illustrates distances that can be measured to characterize acorner coating.

FIG. 11 shows a cross-sectional SEM micrograph of an aluminidizedcrevice at a microchannel corner.

FIG. 12 shows a cross-sectional SEM micrograph of an aluminidized sampleof Inconel™ 617.

FIG. 13 shows a cross-sectional SEM micrograph of a coupon of Inconel™617 that was aluminidized (left), or exposed to air at 400° C. for onehour to grow some surface oxide prior to growing the aluminide layer.

FIG. 14 shows a cross-sectional SEM micrograph of a coupon of Inconel™617 that was aluminidized in the presence of alumina disks.

DESCRIPTION OF THE INVENTION

Microchannel Apparatus

Microchannel reactors are characterized by the presence of at least onereaction channel having at least one dimension (wall-to-wall, notcounting catalyst) of 1.0 cm or less, preferably 2.0 mm or less (in someembodiments about 1.0 mm or less) and greater than 100 nm (preferablygreater than 1 μm), and in some embodiments 50 to 500 μm. A reactionchannel is a channel containing a catalyst. Microchannel apparatus issimilarly characterized, except that a catalyst-containing reactionchannel is not required. Both height and width are substantiallyperpendicular to the direction of flow of reactants through the reactor.Microchannels are also defined by the presence of at least one inletthat is distinct from at least one outlet—microchannels are not merelychannels through zeolites or mesoporous materials. The height and/orwidth of a reaction microchannel is preferably about 2 mm or less, andmore preferably 1 mm or less. The length of a reaction channel istypically longer. Preferably, the length of a reaction channel isgreater than 1 cm, in some embodiments greater than 50 cm, in someembodiments greater than 20 cm, and in some embodiments in the range of1 to 100 cm. The sides of a microchannel are defined by reaction channelwalls. These walls are preferably made of a hard material such as aceramic, an iron based alloy such as steel, or a Ni-, Co- or Fe-basedsuperalloy such as monel. The choice of material for the walls of thereaction channel may depend on the reaction for which the reactor isintended. In some embodiments, the reaction chamber walls are comprisedof a stainless steel or Inconel™ which is durable and has good thermalconductivity. The alloys should be low in sulfer, and in someembodiments are subjected to a desulferization treatment prior toformation of an aluminide. Typically, reaction channel walls are formedof the material that provides the primary structural support for themicrochannel apparatus. The microchannel apparatus can be made by knownmethods (except for the coatings and treatments described herein), andin some preferred embodiments are made by laminating interleaved plates(also known as “shims”), and preferably where shims designed forreaction channels are interleaved with shims designed for heat exchange.Of course, as is conventionally known, “reactors” or “separators” do notinclude jet engine parts. In preferred embodiments, microchannelapparatus does not include jet engine parts. Some microchannel apparatusincludes at least 10 layers laminated in a device, where each of theselayers contain at least 10 channels; the device may contain other layerswith fewer channels.

FIG. 1 is a schematic and simplified view of one embodiment of amicrochannel reactor in which reactant feed passes through a reactionmicrochannel (bottom) while coolant (in a cross-flow arrangement) flowsthrough an adjacent heat exchanger (top). Microchannel reactorspreferably include a plurality of microchannel reaction channels and aplurality of adjacent heat exchange microchannels. The plurality ofmicrochannel reaction channels may contain, for example, 2, 10, 100,1000 or more channels. In preferred embodiments, the microchannels arearranged in parallel arrays of planar microchannels, for example, atleast 3 arrays of planar microchannels. In some preferred embodiments,multiple microchannel inlets are connected to a common header and/ormultiple microchannel outlets are connected to a common footer. Duringoperation, the heat exchange microchannels (if present) contain flowingheating and/or cooling fluids. Non-limiting examples of this type ofknown reactor usable in the present invention include those of themicrocomponent sheet architecture variety (for example, a laminate withmicrochannels) exemplified in U.S. Pat. Nos. 6,200,536 and 6,219,973(both of which are hereby incorporated by reference). Performanceadvantages in the use of this type of reactor architecture for thepurposes of the present invention include their relatively large heatand mass transfer rates, and the substantial absence of any explosivelimits. Microchannel reactors can combine the benefits of good heat andmass transfer, excellent control of temperature, residence time andminimization of by-products. Pressure drops can be low, allowing highthroughput and the catalyst can be fixed in a very accessible formwithin the channels eliminating the need for separation. Furthermore,use of microchannel reactors can achieve better temperature control, andmaintain a relatively more isothermal profile, compared to conventionalsystems. In some embodiments, the reaction microchannel (ormicrochannels) contains a bulk flow path. The term “bulk flow path”refers to an open path (contiguous bulk flow region) within the reactionchamber. A contiguous bulk flow region allows rapid fluid flow throughthe reaction chamber without large pressure drops. In some preferredembodiments there is laminar flow in the bulk flow region. Bulk flowregions within each reaction channel preferably have a cross-sectionalarea of 5×10⁻⁸ to 1×10⁻² m², more preferably 5×10⁻⁷ to 1×10⁻⁴ m². Thebulk flow regions preferably comprise at least 5%, more preferably atleast 50% and in some embodiments, 30-80% of either 1) the internalvolume of the reaction chamber, or 2) a cross-section of the reactionchannel.

In many preferred embodiments, the microchannel apparatus containsmultiple microchannels, preferably groups of at least 5, more preferablyat least 10, parallel channels that are connected in a common manifoldthat is integral to the device (not a subsequnetly-attached tube) wherethe common manifold includes a feature or features that tend to equalizeflow through the channels connected to the manifold. Examples of suchmanifolds are described in U.S. patent application Ser. No. 10/695,400,filed Oct. 27, 2003 which is incorporated herein as if reproduced infull below. In this context, “parallel” does not necessarily meanstraight, rather that the channels conform to each other. In somepreferred embodiments, a microchannel device includes at least threegroups of parallel microchannels wherein the channel within each groupis connected to a common manifold (for example, 4 groups ofmicrochannels and 4 manifolds) and preferably where each common manifoldincludes a feature or features that tend to equalize flow through thechannels connected to the manifold. An aluminide coating can be formedin a group of connected microchannels by passing an aluminum-containinggas into a manifold, typically, the manifold will also be coated.

Heat exchange fluids may flow through heat transfer microchannelsadjacent to process channels (preferably reaction microchannels), andcan be gases or liquids and may include steam, liquid metals, or anyother known heat exchange fluids—the system can be optimized to have aphase change in the heat exchanger. In some preferred embodiments,multiple heat exchange layers are interleaved with multiple reactionmicrochannels. For example, at least 10 heat exchangers interleaved withat least 10 reaction microchannels and preferably there are 10 layers ofheat exchange microchannel arrays interfaced with at least 10 layers ofreaction microchannels. Each of these layers may contain simple,straight channels or channels within a layer may have more complexgeometries.

While simple microchannels can be utilized, the invention hasparticularly strong advantages for apparatus with complex microchannelgeometries. In some preferred embodiments, the microchannel apparatusincludes one or more of the following characteristics: at least onecontiguous microchannel has a turn of at least 45°, in some embodimentsat least 90°, in some embodiments a u-bend; a length of 50 cm or more,or a length of 20 cm or more along with a dimension of 2 mm or less, andin some embodiments a length of 50-200 cm; at least one microchannelthat splits into at least 2 sub-microchannels in parallel, in someembodiments 2 to 4 sub-channels in parallel; at least 2 adjacentchannels, having an adjacent length of at least one cm that areconnected by plural orifices along a common microchannel wall where thearea of orifices amounts to 20% or less of the area of the microchannelwall in which the orifices are located and where each orifice is 1.0 mm²or smaller, in some embodiments 0.6 mm² or smaller, in some embodiments0.1 mm² or smaller—this is a particularly challenging configurationbecause a coating should be applied without clogging the holes; or atleast two, in some embodiments at least 5, parallel microchannels havinga length of at least 1 cm, have openings to an integral manifold, wherethe manifold includes at least one dimension that is no more than threetimes the minimum dimension of the parallel microchannels (for example,if one of the parallel microchannels had a height of 1 mm (as thesmallest dimension in the set of parallel microchannels), then themanifold would possess a height of no more than 3 mm). An integralmanifold is part of the assembled device and is not a connecting tube. Acomplex microchannel is one type of interior microchannel. In someapparatus, a microchannel contains a u-bend which means that, duringoperation, flow (or at least a portion of the flow) passes in oppositedirections within a device and within a continguous channel (note that acontiguous channel with a u-bend includes split flows such as a w-bend,although in some preferred embodiments all flow within a microchannelpasses through the u-bend and in the opposite direction in a singlemicrochannel).

In some embodiments, the inventive apparatus (or method) includes acatalyst material. The catalyst may define at least a portion of atleast one wall of a bulk flow path. In some preferred embodiments, thesurface of the catalyst defines at least one wall of a bulk flow paththrough which the mixture passes. During operation, a reactantcomposition flows through the microchannel, past and in contact with thecatalyst. In some preferred embodiments, a catalyst is provided as aninsert that can be inserted into (or removed from) each channel in asingle piece; of course the insert would need to be sized to fit withinthe microchannel. In some embodiments, the height and width of amicrochannel defines a cross-sectional area, and this cross-sectionalarea comprises a porous catalyst material and an open area, where theporous catalyst material occupies 5% to 95% of the cross-sectional areaand where the open area occupies 5% to 95% of the cross-sectional area.In some embodiments, the open area in the cross-sectional area occupiesa contiguous area of 5×10⁻⁸ to 1×10⁻² m². In some embodiments, a porouscatalyst (not including void spaces within the catalyst) occupies atleast 60%, in some embodiments at least 90%, of a cross-sectional areaof a microchannel. Alternatively, catalyst can substantially fill thecross-sectional area of a microchannel (a flow through configuration).In another alternative, catalyst can be provided as a coating (such as awashcoat) of material within a microchannel reaction channel orchannels. The use of a flow-by catalyst configuration can create anadvantageous capacity/pressure drop relationship. In a flow-by catalystconfiguration, fluid preferably flows in a gap adjacent to a porousinsert or past a wall coating of catalyst that contacts the microchannelwall (preferably the microchannel wall that contacts the catalyst is indirect thermal contact with a heat exchanger (preferably a microchannelheat exchanger), and in some embodiments a coolant or heating streamcontacts the opposite side of the wall that contacts the catalyst).

Other Substrates

In preferred embodiments, the inventive apparatus, catalysts or methodscontain or use an aluminide coating on an interior microchannel. Inpreferred embodiments, the invention includes an aluminide layer, analumina layer and a catalyst material coated onto an interiormicrochannel wall. However, in some embodiments, the aluminide-coatedmicrochannel contains a “porous catalyst material” as described below.For example, a porous catalyst material such as a porous metal foamcould be coated with an aluminide layer to form a catalyst. In otherembodiments, the invention includes a catalyst (or method of making acatalyst) in which an aluminide layer is formed on a substrate (catalystsupport) other than a microchannel wall. Thus, in some embodiments, theinvention includes a substrate, an aluminide coating over the substrate,and a catalyst material over the aluminide (preferably with anintervening alumina layer)—the substrate may have a conventional formsuch as pellets or rings; in some embodiments the substrate is not anexpanded metal sheet. As in the case of microchannel walls, preferredcatalyst supports are preferably formed of a Ni-, Co-, or Fe-basedsuperalloy.

A “porous catalyst material” (or “porous catalyst”) refers to a porousmaterial (that may be an insert) having a pore volume of 5 to 98%, morepreferably 30 to 95% of the total porous material's volume. At least 20%(more preferably at least 50%) of the material's pore volume is composedof pores in the size (diameter) range of 0.1 to 300 microns, morepreferably 0.3 to 200 microns, and still more preferably 1 to 100microns. Pore volume and pore size distribution are measured by Mercuryporisimetry (assuming cylindrical geometry of the pores) and nitrogenadsorption. As is known, mercury porisimetry and nitrogen adsorption arecomplementary techniques with mercury porisimetry being more accuratefor measuring large pore sizes (larger than 30 nm) and nitrogenadsorption more accurate for small pores (less than 50 nm). Pore sizesin the range of about 0.1 to 300 microns enable molecules to diffusemolecularly through the materials under most gas phase catalysisconditions. The porous material can itself be a catalyst, but morepreferably the porous material comprises a metal, ceramic or compositesupport having a layer or layers of a catalyst material or materialsdeposited thereon. The porosity can be geometrically regular as in ahoneycomb or parallel pore structure, or porosity may be geometricallytortuous or random. Preferably, a large pore support is a foam metal orfoam ceramic. The catalyst layers, if present, are preferably alsoporous. The average pore size (volume average) of the catalyst layer(s)is preferably smaller than the average pore size of the support. Theaverage pore sizes in the catalyst layer(s) disposed upon the supportpreferably ranges from 10⁻⁹ m to 10⁻⁷ m as measured by N₂ adsorptionwith BET method. More preferably, at least 50 volume % of the total porevolume is composed of pores in the size range of 10⁻⁹ m to 10⁻⁷ m indiameter.

Metal Aluminide Layer

In some embodiments of the invention, at least a portion of at least oneinterior wall of a microchannel apparatus (preferably a microreactor) iscoated with a layer of a metal aluminide (preferably nickel aluminide(NiAl)). It has been surprisingly discovered that an alumina wallcoating formed by oxidizing a metal aluminide (NiAl in the examples)coating provides superior corrosion resistance as compared to eitherthermally grown oxide layer (grown from the substrate without forming analuminide) or a solution deposited alumina layer. It is believed thatexceptionally uniform coatings result from solid state reaction ofaluminum deposted at the surface from the gas phase and nickel diffusingout from the substrate towards the surface. In addition, nickel may beplated onto a metal that is not rich in nickel, such as stainless steel,to create a reactive surface for the aluminidization process. Nickelaluminide could also be deposted by supplying both Al and Ni precursorsin the vapor phase concurrently or as a mixture. In a related aspect, acatalyst or catalyst intermediate is formed on substrates having such anickel aluminide surface. Of course, the invention also includes methodsof making catalysts or microchannel apparatus comprising coating asubstrate (preferably a Ni-based alloy) with chemical vapor depositedaluminum that is simultaneously and/or subsequently converted to analuminide (such as NiAl).

A NiAl layer can be formed by exposing a Ni-based alloy to AlCl₃ and H₂at high temperature, preferably at least 700° C., in some embodiments900 to 1200° C. Aluminum is deposted at the surface as a result of thereaction between AlCl₃ and H₂. At temperature, Ni from the substratewould diffuse towards the surface and react with the aluminum to form asurface layer of nickel aluminide. The Ni source could be Ni in aNi-based alloy substrate, an electrolytically plated Ni layer, or avapor deposited Ni layer that can be deposited over a substrate prior toaluminidization. It is believed that other metal aluminides (such as Coor Fe) could be formed under similar conditions.

Preferably the aluminidization is conducted with good control of flow tothe device through a manifold, for example, good control can be obtainedby passing flow into microchannels through a leak-free manifold that isintegral to the microchannel device. Preferably the aluminidizationprocess is carried out at 100 Torr (2 pounds per square inch absolute,psia) to 35 psia (1800 Torr), more preferably between 400 Torr (8 psia)and 25 psia (1300 Torr).

In preferred embodiments, nickel aluminide contains 13 to 32% aluminum,more preferably 20 to 32%; and still more preferably consistsessentially of beta-NiAl. If Al falls significantly below the 13% weight% level of the gamma-prime phase, it may be expected to negativelyaffect the quality of the thermally-grown alumina scale.

In some embodiments, the metal aluminide layer has a thickness of 1 to100 micrometers; in some embodiments a thickness of 5 to 50 micrometers.In some embodiments, the aluminide layer is completely oxidized;however, this is generally not preferred.

The metal surface upon which the metal aluminide is formed is preferablysubstantially free of oxides. Optionally the surface can be cleaned,polished, or otherwise treated to remove such oxides if any are present.

A reactor can be formed by a catalyst that is disposed as a coating onan internal wall (where the walls can be simple walls or shaped walls).Alternatively, or in addition, inserts such as fins, plates, wires,meshes, or foams can be inserted within a channel. These inserts canprovide additional surface area and effect flow characteristics. Analuminization process can be used to fix inserts onto a wall of a device(such as a reactor); the resulting aluminum layer (or aluminum oxide, oraluminum, or metal aluminide, or a mixture of these) fills some voidsand greatly improves thermal conduction between the insert and devicewall (such as reactor wall).

Thermally Grown Oxide

Metal aluminide or more preferably NiAl layer, is heated in the presenceof oxygen or other oxidant to grow a layer of aluminum oxide. It wassurprisingly discovered that when the surface was heated to thetreatment temperature in the absence of O₂ or other oxidant prior to theoxide growth at temperature, a significantly improved oxide coatingresulted. The oxide layer grown by heating the surface to the treatmenttemperature in the presence of oxygen exhibited spalling while the layergrown by heating the surface from ambient temperature to the treatmenttemperature in the absence of oxygen did not. Oxygen can besubstantially excluded from the heat up step of the heat treatmentprocess.

A convenient and preferred method of excluding oxygen from the surfacewhile heating the surface from ambient temperature to treatmenttemperature involves exposure to hydrogen. The hydrogen effectivelyreduces the oxidizing power of the atmosphere during heat up to preventpremature growth of the oxide scale. Other gases that reduce theoxidizing power of the gas, such as NH3, CO, CH4, hydrocarbons, or thelike, or some combination of these could also be used. All of thesereducing gases could be used in combination with inert gases such as N2,He, Ar, or other inert gases, or combinations of inert gases.

The oxide layer is formed by exposing the surface to an oxidizingatmosphere at or within 100 C of the treatment temperature. Theoxidizing gas could be air, diluted air, oxygen, CO2, steam or anymixture of these gases or other gases that have substantial oxidizingpower, with or without an inert diluent. The inert diluent could beinert gases such as N2, He, Ar, or other inert gases, or a combinationof inert gases. The temperature of oxide growth is at least 500° C.,preferably at least 650° C. The surface can be exposed to the treatmentcondition in stages of different temperatures, different oxidizingpowers, or both. For example, the surface could be treated at 650° C.for a time and then heated to 1000° C. and kept at 1000° C. for anadditional time. Such controlled and staged surface treatment cangenerate a surface structure of a desired morphology, crystalline phaseand composition.

Superior oxide coatings result from preheating to about 1000° C. (insome embodiments at least 900° C.) under an inert, or preferably, areducing atmosphere such as a H₂-containing atmosphere (preferably atleast 1000 ppm H₂, in some embodiments 1 to 100% H₂). Preheat under areducing atmosphere was observed to produce superior oxide coatings withlittle or no spalling. It is believed that this control of preheatconditions results in superior coatings because it minimizes theformation of nickel oxide. Great care must be taken selecting a truly“inert” atmosphere because atmospheres conventionally considered asinert atmospheres yield inferior results. That is because nickel oxidecan theoretically form even at 10⁻¹⁰ atm oxygen and chromia at 10⁻²¹ atmoxygen; such extreme levels of purity are not available in commerciallyavailable gases. Therefore, reducing atmospheres are preferred.

Conventional wisdom suggests that the higher the temperature, the fasterthe oxidation rate. Surprisingly, we discovered that the oxide grewfaster at 1000° C. than at 1050° C. One possible explanation is that thehigh temperature oxide could be denser, thus discouraging faster growth.The lower temperature oxide could be more porous thus allowing fasteroxide growth. On the other hand, too high a temperature will promoteinterdiffusion between the aluminide layer and the substrate, and thealuminide will disappear into the bulk of the alloy. Therefore, thethermally-grown oxide is preferably conducted in the temperature rangeof 1000 to 1100° C., more preferably 1025-1075° C. In the presence ofexcess oxygen, for example flowing air, the oxidation treatment ispreferably conducted for 30 to 6000 min, more preferably 60 to 1500 min.

Although it had never previously been known for making catalysts, it hasbeen known that theta (Θ) alumina whiskers can be grown from NiAl.Alumina whiskers are substantially rod-shaped or needle-shaped with anaspect ratio of at least 10. An example of these whiskers on Inconel isshown in FIG. 2.

It should be recognized that the term “alumina” can be used to refer toa material containing aluminum oxides in the presence of additionalmetals. In the descriptions herein, unless specified, the term “alumina”encompasses substantially pure material (“consists essentially ofalumina”) and/or aluminum oxides containing modifiers.

Thinner layers are less prone to cracking; therefore, thethermally-grown oxide layer is preferably 5 μm thick or less, morepreferably preferably 1 μm thick or less, and in some embodiments is 0.1μm to 0.5 μm thick. In some preferred embodiments, the articles have anoxide thickness of a thermally grown scale of less than 10 micrometers,and in some embodiments an oxide thickness of a thermally grown scale inthe range of about 0.1 to about 5 micrometers. In some embodiments,thicker oxide layers may be useful, such as for a higher surface areacatalyst support. In some preferred embodiments, the articles have anoxide thickness of a washcoat of less than 10 micrometers, and in someembodiments an oxide thickness of a washcoat in the range of about 1 toabout 5 micrometers. Typically, these thicknesses are measured with anoptical or electron microscope. Generally, the thermally-grown oxidelayer can be visually identified; the underlying aluminide layer ismetallic in nature and contains no more than 5 wt % oxygen atoms;surface washcoat layers may be distinguished from the thermally-grownoxide by differences in density, porosity or crystal phase.

The aluminized surface can be modified by the addition of alkaline earthelements (Be, Mg, Ca, Sr, Ba), rare earth elements (Y, La, Ce, Pr, Nd,Pm, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu) or combinations of these.The addition of these elements is followed by a reaction with anoxidizing atmosphere to form a mixed oxide scale. When the modifyingelement is La, for example, the scale contains LaAlOx, lanthanumaluminate. In some embodiments, a stabilized alumina surface can beformed by adding a rare earth element such as La, coated with a layer ofalumina sol, then doped with an alkaline earth element such as Cafollowed by a heat treatment.

La was demonstrated to be effective in improving the adhesion betweenthe sol-alumina coating and the alumina scale. Inconel™ 617 substrateafter aluminization and heat treatment was coated with an aqueoussolution of La nitrate, followed by drying and air calcination at 1,000°C. for 4 hr. It was then coated with sol-alumina and exposed to thecorrosion testing environment at 960° C. for 1,000 hr. The sol-aluminacoating survived well, with no visible signs of damage such as flakingor cracking. In contrast, similar testing with an Inconel™ 617 substrateafter aluminization and heat treatment and coated with sol-aluminawithout pretreatment with an aqueous solution of La nitrate, showed thatmost of the sol-alumina coating was lost after only 100 hr of testing,suggesting insufficient adhesion between the sol-alumina and thealpha-alumina scale on the aluminide.

The benefit of La as an adhesion promoter is believed to be associatedwith its reaction with the alpha alumina scale to change the surface toa more chemically active La aluminate. Surface X-ray diffraction (XRD)showed the formation of LaAlO₃. Without La addition, only alpha aluminaand some background nickel aluminide could be detected by surface XRD.

Flow Rates

The aluminum-containing layer and alumina layers are preferably formedby reacting a surface with a gaseous reactant or reactants under dynamicflow conditions. The aluminum can be deposited in a microchannel byflowing AlCl₃ and H₂ into a microchannel. In a multichannel device, theAl can be deposited only on selected channels (such as by pluggingcertain channels to exclude the aluminum precursors during a CVDtreatment). The aluminum can also be applied onto selected portions of amicrochannel device by controlling relative pressures. For example, in amicrochannel device that contains at least two channels separated by awall and in which the two channels are connected to each other viaorifices in the wall, AlCl₃ flows through a first channel while H₂, at ahigher pressure, flows through a second channel and through the orificesinto the first channel.

Static gas treatments can be conducted by filling the desired areas withthe reactive gases with interim gas pumping if needed.

It has been found that excessively high flow rates can lead to unevencoatings. An example of this problem can be seen in FIG. 3.

Two flow metrics have been established for characterizing the extent ofshear and jet impaction. For mechanical shear, the total wall shearstress (two tangential components and one normal component) has beenselected as the relevant metric. Likewise dynamic pressure, which isequal to the momentum flux of the jet plume, has been chosen as a meansof monitoring the effects of jet impaction on coating formation.

Computational fluid dynamic (CFD) simulations of several devicealuminization tests were conducted to contrast the predicted values forwall shear stress and dynamic pressure in regions where the treatmentwas not successful to those regions where treatment was successfullyapplied. These simulations used as boundary conditions the sametemperature, flow rates, stream composition, and flow input/out putconfiguration as was used in the respective device aluminizationprocess. Comparisons utilized autopsy results of aluminized and heattreated devices. It was determined from these studies that there couldbe established a threshold value for both wall shear stress and dynamicpressure whereby for flow conditions in which both shear and dynamicpressure were below the threshold values, good treatment should takeplace; and when the threshold value of either variable was exceeded, thetreatment could be flawed.

Metric Thresholds

Wall shear stress is expressed as τ=μ|{right arrow over (∇)}u| or theproduct of the fluid viscosity μ and the magnitude of the local velocitygradient, expressed in units of force per channel wall unit surfacearea. This quantity reflects the magnitude of the molecular frictionalforces at the interface between a very thin fluid layer and the channelwall itself.

The dynamic pressure (or equivalently the momentum flux) is given by theexpression p=½ρu² where ρ denotes the fluid density and u the localfluid velocity magnitude. It is a measure of the force imparted by thechange in momentum when a jet plume strikes the side of a channel and isalso expressed in terms of force per unit area. CFD simulations of anumber of combustion test devices were performed to determine if therewas any definitive correlation between poor aluminide coating andcritical values in either wall shear stress or dynamic pressure.

Based on a detailed analysis of the tested devices, the followingthresholds were established:

Wall Shear Stress: To ensure drag forces do not impair the formation ofaluminization coating, the wall shear stress should not exceed 50 Pa ifthe aluminization gases are flowing through a jet orifice. Allowablewall shear stress should not exceed 200 Pa if the aluminization gasesare not impinging on the wall of a microchannel as through a jetorifice.

Wall Dynamic Pressure: To ensure momentum impact erosion does not impairthe adequate formation of aluminization coating, the wall dynamicpressure should not exceed 10 Pa if the aluminization gases are flowingthrough a jet orifice. Substantially higher wall dynamic pressure isallowed in the absence of a jet orifice. Allowable wall dynamic pressureshould not exceed 100 Pa if the aluminization gases are not impinging onthe wall of a microchannel as through a jet orifice.

Practical Application

The metrics presented above are used to determine the flow configurationand individual inlet flow rates that will imply good aluminizationtreatment from a fluidics standpoint. Generally there are a combinationof possible input and output flow paths for a device. CFD predictionsare used to determine those inflow/outflow combinations and theindividual inlet flow rates that will result in globally maintaining thewall shear stress below 5×10⁻³ PSI and the wall dynamic pressure below1×10⁻³ PSI throughout the entire device. The maximum allowable inletflow rate that satisfies these two criteria and the associated flowconfiguration becomes the maximum recommended rate for aluminizing thedevice based on the metrics developed here. Examples of the aluminidecoating resulting from this guidance produced aluminide coatings withoutvisual defects.

A surprising discovery of this invention is that flowing (nonstatic, seeprevious discussion on preferred pressures) aluminizing gas at ratesbelow the threshold rates discussed above produced defect-free, highlyuniform (less than 10% variation in thickness) aluminide coatings.

Masking

The aluminizing processes discussed above produce aluminide coatingsthroughout a channel. However, it is theoretically possible toselectively coat portions of a channel by masking off sections of achannel. This might be done by masking portions of a sheet with arefractory material and then laminating the masked sheet into alaminate. After aluminization the mask could be removed, such as byburning. Possible refractory materials might include Mo, diamond, andgraphite. Masking techniques have been mentioned in U.S. Pat. No.6,332,926.

Acid or Base Etch

Adhesion and/or surface area can be increased by an acid or base etch.Preferably this is conducted at moderate conditions on the thermallygrown alumina layer. Severe conditions may result in excessive etching.Therefore, the (optional) etching step or steps are conducted at a pH ofless than 5 (preferably 0 to 5) or greater than 8 (preferably 8 to 14).

Sintering Aids

A sintering aid can be added either as a solution applied onto thealumina scale or in a mixture. The purpose of a sintering aid is twofold: 1) locally reduce melting temperatures of the oxide substrate(e.g., the oxide scale) to promote diffusional bonds between it and theceramic particles and 2) to create a glassy phase that forms at grainboundaries and suppress oxygen diffusion from further oxidizing anunderlying metallic substrate. For alumina layers, sintering aidscomprise Na, Li and/or B. Aqueous compositions comprising (or consistingessentially of) Li or Na borate salts constitute a particularlypreferred treatment for an alumina scale. In some preferred embodiments,the invention comprises an oxide layer disposed over a metal substratewhere the oxide scale comprises metal oxide particles having sinteringaid elements dispersed along the grain boundaries and, preferably, onthe surface. Sintering aids can be chosen which are benign or preferredto the target catalytic processes.

In a preferred embodiment, a sintering aid is applied to the surface ofan oxide scale. The resulting surface is then treated with a ceramicsuspension. In a particularly preferred embodiment, the ceramicsuspension comprises a solvent, ceramic particles, a dispersant toprevent particle agglomeration, an organic binder to provide strength tothe film of ceramic particles when dried, and a plasticizer to increasethe plasticity of the binder. Platicizers, surfactants, and binders areorganic materials which can be readily removed by simple calcinations inair at relatively low temperatures. The resulting article is dried toremove liquid and then heated to elevated temperatures. During thisprocess, the sintering aid locally melts the ceramic particles atcontact points (with the applied oxide particles) and promotesdiffusional bonding between the oxide scale and the ceramic particles.In some of its broader aspects, this process is general and can beapplied over any oxide layer that is subsequently treated with acompostion of oxide particles. Additional coatings with oxidecompositions can increase thickness of the oxide layer and providesupport for subsequent application of catalytically active particles.Selection of appropriate treatment temperatures and/or control ofsintering aid levels can prevent excessive surface area reduction insubsequently applied oxide layers.

In some embodiments, an oxide surface is treated with a sintering aidand then heat treated. Subsequently, the resulting surface is treatedwith ceramic particles (for example, in the form of a powder orsuspension). In one test, an alumina disk was treated with a compositionmade by dissolving 1.66 g PVA, 3.3 g Li₂B₄O₇ and 7.4 g Na₂B₄O₇.10H₂O in83 g of water. The disk was then heat treated at 900 C for one hour.Alumina powder was then sprinkled over the disk and the treated disk wasagain heat treated at 900 C for one hour. Results are shown in FIG. 2which shows that the treated disk exhibited sintering and adhesion ofthe alumina powder. Better sintering was observed on the treated vs.untreated area of the disk, with formation of a glassy phase at thegrain boundaries.

The sintering aid or aids should be added in an amount sufficient toobtain its desired purpose. Thus, in some embodiments, sufficientamounts of sintering aids are added such that an increased amount ofglassy phase is observed as compared with an identically treated samplewithout sintering aids. Sintering aids (when used) are preferablypresent in coating solutions in at least 0.5 wt %. A coating or a layerin a coating may have sintering aids in an amount of at least_wt %, insome embodiments at least 0.5 wt %. The wt % refers to wt % in an oxidecoating or in a layer within a coating among multiple layers (themultiple layers can be oxide or nonoxide layers). Preferably, the oxidelayer containing the sintering aid is alumina.

As shown in FIG. 4, excellent film formation was observed for an Inconelspecimen that was aluminidized, heat treated to grow an oxide scale,etched with base, coated with a sintering aid solution, and heattreated.

FIG. 5 schematically illustrates an application in which a metalsubstrate 42 has a first layer of aluminide 44, a layer of alumina withsintering aid(s) 46, and a layer of alumina 48. In preferredembodiments, the outermost layer further comprises an additionalcatalytically active material 49.

Several Theologically enhanced suspensions were prepared and tested.These suspensions contained water as the solvent, 14 to 15 wt % aluminumoxide powder as the ceramic particles, 1.43 wt % Tergital® (nonylphenolpolyethylene glycol ether) as the surfactant, 0.14 wt % poly-ethyleneglycol (PEG) as the plasticizer and 0.28 wt % polyvinylpyrrolidone (PVP)as the binder. These suspensions exhibited superior coating propoertiesas compared with unmodified alumina.

More generally, sintering aids can be used in preparing thin ceramicfilms. This type of formulation could be used as a high-temperatureadhesive to create complex ceramic shapes, to develop oxygen impermeablethermal barrier coatings, as well as wear or chemically resistantcoatings. For instance, it could find application in the semiconductorindustry where tape casting is used to develop multi-layer ceramicmodules, the fuel cell industry where ceramic parts are used to developsolid oxide fuel cells, surfaces inside chemical reactors, and/or theautomotive industry for chemically resistant, wear resistant coatings.Especially preferred uses of the sintering aids are in forming ceramiclayers in catalysts (typically having another higher surface areacatalyst support layer and a catalytically active material that may bein an additional layer or within the support layer), and in protectingsurfaces of microchannel apparatus.

Other Coating Modifications

Various other modifications can be used to enhance adhesion or otherproperties of alumina coatings over the alumina scale. An aluminacoating can be deposited using an alumina sol or slurry.

In some preferred embodiments, instead of a single alumina coating,multiple alumina coatings are applied to the surface where at least twoof the layers (more preferably at least 4 layers) have gradedproperties. For example, a first coat could be calcined at a firsttemperature (T1) and a subsequently deposited coat calcined at a lowersecond temperature (T2) resulting in graded coatings of increasingsurface area. Other graded layers could be formed by: the graded use ofwater vapor during calcination; differing particle sizes in the coatings(smaller particles could be used for the first coat or coats thusincreasing physical contact between the particles and the scale, whilelarger particles are present in later coats); and/or the graded use ofstabilizers or binders (where the binders are subsequently burned out).

Additives such as rare earths or alkaline earth elements (including La,Ce and/or Pr) can increase hydrothermal stability of an alumina coating.

Surfactants can be added to coating solutions. Preferred classes ofsurfactants include: colloidal, non-ionic, anionic, cationic, andamphoteric, and in some embodiments, surfactants are present in at least0.1 wt %, in some embodiments at least 0.01 wt %, and in someembodiments in the range of 0.01 to 5 wt %. Water soluble polymers suchas polyvinylalcohol (PVA), polyvinylpyrrolidone, PLE, and polycup can beadded to the coating composition. The polymers may reduce crackingduring drying and form added porosity after burn out. The addition oftitanium oxide to promote adhesion is another possibility.

Prior to coating, the alumina scale can be treated with rare earths oralkaline earth elements (including Mg or La) (and, optionally, asurfactant such as polyvinylalcohol) followed by a high temperaturetreatment to make the scale's surface more active for adhesion. Use ofwetting agents and surfactants increases the amount of additive metalthat can be added to the alumina surface in each solution coating step.

Catalyst Coatings

Catalysts can be applied using techniques that are known in the art.Impregnation with aqueous solutions of salts is preferred. Pt, Rh,and/or Pd are preferrred in some embodiments. Typically this is followedby heat treatment and activation steps as are known in the art. Saltswhich form solutions of pH>0 are preferred.

Reactions

The coated microchannel apparatus is especially useful when used with asurface catalyst and at high temperature, for example, at temperaturesabove 500° C., in some embodiments 700° C. or higher, in someembodiments 900° C. or higher.

In some aspects, the invention provides a method of conducting areaction, comprising: flowing at least one reactant into a microchannel,and reacting the at least one reactant in the presence of a catalystwithin the microchannel to form at least one product. In someembodiments, the reaction consists essentially of a reaction selectedfrom: acetylation, addition reactions, alkylation, dealkylation,hydrodealkylation, reductive alkylation, amination, ammoxidation,ammonia synthesis, aromatization, arylation, autothermal reforming,carbonylation, decarbonylation, reductive carbonylation, carboxylation,reductive carboxylation, reductive coupling, condensation, cracking,hydrocracking, cyclization, cyclooligomerization, dehalogenation,dimerization, epoxidation, esterification, exchange, Fischer-Tropsch,halogenation, hydrohalogenation, homologation, hydration, dehydration,hydrogenation, dehydrogenation, hydrocarboxylation, hydroformylation,hydrogenolysis, hydrometallation, hydrosilation, hydrolysis,hydrotreating (HDS/HDN), isomerization, methylation, demethylation,metathesis, nitration, polymerization, reduction, reformation, reversewater gas shift, Sabatier, sulfonation, telomerization,transesterification, trimerization, and water gas shift. Combustion isanother preferred reaction. Hydrocarbon steam reforming is especiallypreferred (such as methane, ethane or propane steam reforming).

EXAMPLES

Corrosion Protection

Samples of Inconel™ 617 were corrosion tested with and without aprotective aluminide coating. The aluminide coated sample was made byforming a layer of aluminide and heating under H2 atmosphere and thenexposing to air at 1050° C. Both samples were corrosion tested at 960°C. and 17% water, 2.5% O₂ for 1000 hours. The uncoated sample showedpitting after 100 hours of testing. In contrast, the aluminide/aluminacoated sample showed no observable change after 1000 hours of corrosiontesting. See FIG. 6, which shows no damage to the alumina layer. Thegrain boundaries shown in the figures were also present prior to thecorrosion testing. Further corrosion testing to 4400 hours also showedno damage to the coating.

Uniform Coatings in a Multichannel, Microchannel Device

A microchannel device (FIG. 7) having 48 sets (4×12) of parallelchannels, with each set consisting of 5 individual channels. The deviceis designed for steam reforming of methane (SMR) and contains anintegrated combustor (Fuel, Air and Exhaust for the combustion andReactant and Product for the SMR). The device is over 20 inch (50 cm)long, making the aluminization circuit over 40 inch (1.0 m) long(Exhaust connected to Fuel and Air, Product connected to Reactant). TheFuel and Air channels are in communication via an array of jet holes ineach pair of channels.

The SMR channels were blanketed off with an argon flow while channels inthe combustion circuit were aluminidized. Calculations showed that theflow of aluminizing gas through the microchannels was highly non-uniformwith flow rates in some channels 10 times greater than others, while thesurface area within each microchannel was relatively similar. Thisdifference in flows is due to the complex design of the channels. TheCVD vapor flow was fed from the exhaust manifold, flowed through theexhaust channels, through a u-bend and then into the fule and airchannels and exited through the fuel and air manifolds. Afteraluminidization, the device was cut open and various channels wereinspected by SEM. Cross-sectional samples were viewed at the midpoint ofthe device (FIG. 8) and near one end—this end is both near the start ofthe aluminization circuit (exhaust channel) and the end of thealuminidization circuit (air and fuel channels), FIG. 9.

From the SEM data it can be seen that the aluminide coatings were highlyuniform both along the length of each channel as well aschannel-to-channel, despite the large difference in channel-to-channelflow rates. In each case, coating thicknesses appeared to be withinabout 10%. Additionally, the coatings appeared to be essentiallydefect-free.

Coatings at Corners

Interior corners of microchannel devices were inspected by SEM. Thesedevices were again Inconel™ 617 coated with an aluminide layer. Sharp(90±20°), well-formed corners coated with an aluminde layer weresurprisingly found to have conformal coatings (see FIG. 10 a) with asharp angle at the interface between the channel's interior (dark area)and the aluminide coating. For purposes of measuring the angle of thecoating, the angle of the coating is based on averaging surfaceroughness for 100 μm along each edge from the corner. In some preferredembodiments, the angle of the coating is 90±20°, in some preferredembodiments 90±10°. Another measure is the thickness ((d1+d2)/2) of thecoating at the perimeter of the corner coating (see FIG. 10 b) based onextensions (d1 and d2) of the same 100 μm lines used to measure coatingangle; preferably this thickness of the coating at the perimeter of thecorner coating is within 25%, more preferably within 10% of either theaverage coating thickness (averaged over a microchannel wall, ormicrochannel wall segment, terminating at the corner), or within 25%,more preferably within 10% of either the midpoint thickness (measured atthe midpoint of a microchannel wall, or microchannel wall segment,terminating at the corner).

Crack filling is shown in FIG. 11. In this example, the Inconel sheetswere stamped. The stamping process tends to result in slightly curvededges, and these curved edges can result in gaps at the corners formedbetween two laminated sheets. The aluminide coating fills this gap,again this occurs in a conformal fashion with the thickness of thecoating being uniform with elsewhere on the microchannel up until thepoint that the gap is filled and the coating can no longer grow. Inother words, thickness appears to be limited by distance from the metalsubstrate.

Multichannel Sol Coated Device

A microchannel test device with 48 sets of channels was prepared withpost-assembly coatings and tested. The device was made from sheets of anInoconel™ Ni-based superalloy. An aluminide layer was formed over thealloy. Then it was oxidized (as described above) to form an aluminalayer. Several solution-based coatings were applied. To apply thecoatings, the device was oriented on one end (the straight microchannelswere oriented parallel to gravity), and, in each step, the liquid wasadded through an inlet located at the bottom (with respect to gravity),into a manifold and up into the microchannels. The level of liquid inthe manifolds was controlled by use of a manometer. The fluid was thendrained by gravity and a N₂ purge cleared remaining liquid from themicrochannels. In this example, the thermally grown alumina layer wasfirst treated with a La-containing solution, then an alumina sol, thenLa-containing solution, and finally a Pt-containing solution. The devicewas then cut into pieces for analysis. The coatings exhibited excellentadhesion with no flaking. Elemental analyses were conducted at 100×,500× and 2000× magnifications using energy dispersive spectroscopy (EDS)at 20 kV excitation energy. Unless specified otherwise, this is thecondition (at 100×, or if 100× is larger than the area available, thenthe largest available area for SEM) that should be used for elementalanalysis of any coatings described herein (recognizing that somemodifications may be required if such measurment conditions areimpracticable for particular systems). As is well-known, this techniquemeasures the surface composition, as well as some thickness below thesurface.

Six channels (two sets of 3 channels) were analyzed. From each set of 3channels there were 2 channels on an edge of the device and one in themiddle. The coatings in the six channels were analyzed at the top andbottom (with respect to gravity during washcoating) of the coatedsection. The wt % Pt in each channel are shown below: Channel No. 1 2 34 5 6 top 42 38 42 25 28 29 bottom 46 33 41 52 45 61As can be seen, there was not a consistent trend in every microchannel.In the second set of microchannels (4, 5, 6) there appears to have beena problem with filling, draining, or both. The second set of channelscontained about twice as much coating at the bottom of the channel thanat the top. Perhaps, during the washcoating stage, the first set ofchannels drained efficiently, while the second set did not. There alsoappeared to be an effect in which the outer microchannels contained morecoating, perhaps due to slower draining of these channels.Heat Treatments

Inconel™ 617 coupons were aluminidized and heat treated under a varietyof conditions. A coupon aluminized to form the aluminide coating, butnot oxidized, is shown in FIG. 12. The aluminide layer was about 30 μmthick and there was an interdiffusion zone between the aluminide layerand the alloy that was about 5 μm thick. The aluminide layer contained28 to 31 wt % Al which corresponds to NiAl.

Heat treament of an aluminidized coupon at 1100° C. for 100 hours causedthe interdiffusion zone to essentially disappear and there was asubstanital loss of aluminum from the aluminide layer into the alloy.Treatment of an aluminidized coupon at 1050° C. for 100 hours did notshow loss of the aluminide coating.

Effect of Oxide Presence During Aluminidization Process

FIG. 13 shows a comparison between a standard aluminidized coupon and acoupon heat treated in air at 400° C. for 1 hr to purposely grow somenative oxide of chromia before being aluminized. A thin dotted line ofinclusions in the aluminide is observed in the coupon with native oxidebefore aluminization. Such a line of inclusions could become a weakpoint in terms of adhesion. Reference to these figures should be takenwhen deciding whether an aluminide layer is substantially with orwithout oxide defects between an aluminide layer and a metal substrate.

Coating defects were also observed on FeCrAlY fins that werealuminidized in the presence of an alumina disk. FIG. 14 shows largevoids in the aluminide layer of an Inconel™ 617 coupon that wasaluminidized in the presence of an alumina disk.

In early attempts at the aluminidization of a multichannel device, itwas discovered that the channels nearest the gas inlet (that is, theinlet for the aluminum compounds) showed the most inclusions while thechannels furthest away showed the least. This is believed to have beencaused by surface oxides in the tubing or manifolding in the pathway ofthe aluminum compounds prior to the microchannels. The presence ofsurface oxide in the tubing was confirmed by EDS. To avoid thesedefects, care should be taken to avoid the use components that havesurface oxides in the aluminidization process, especially surface oxidesalong the fluid pathway (that is, the pathway carrying aluminumcompounds) leading to a microchannel device. In some preferredtechniques, the tubing and/or other fluid pathways are subjected to atreatment to remove surface oxides (brightened), such as by a hydrogentreatment, KOH etching, electro-polishing or micro-brushing. Of course,before aluminidization, the microchannels may also be subjected to atreatment for the removal of surface oxide.

In preferred embodiments, the aluminide layer and the interfaces of thealuminide layer with the alloy substrate and an oxide layer (if present)is preferably substantially without voids or inclusions that are largerthan 10 μm, more preferably substantially without voids or inclusionsthat are larger than 3 μm. “Substantially without voids or inclusions”excludes coatings such as shown in FIG. 14 and other structures havingnumerous (that is, more than about 5 large or a single very large)defects in 50 μm of length along a channel, but wouldn't exclude astructure shown on the left of FIG. 13 that shows a small number ofisolated defects.

1. A microchannel reactor or separator, comprising: a complexmicrochannel defined by at least one microchannel wall; and a layer ofaluminide disposed over the at least one microchannel wall.
 2. Thereactor or separator of claim 1 further comprising a layer of aluminadisposed over the layer of aluminide; and a catalytic material disposedover the layer of alumina.
 3. The reactor or separator of claim 1wherein the complex microchannel comprises at least one continguousmicrochannel having at least one angle of at least 45°.
 4. The reactoror separator of claim 1 comprising a manifold that is connected to atleast two microchannels, wherein the manifold comprises a manifold wallthat is coated with an aluminide layer.
 5. The reactor or separator ofclaim 1, wherein the layer of aluminide is a post-assembly coating andfurther wherein the reactor or separator is made by laminating togethersheets.
 6. A method of conducting a chemical reaction or separating amixture comprising at least two components in the reactor or separatorof claim 1, comprising either: (a) wherein the reactor or separator is areactor and the reactor further comprises a layer of alumina disposedover the layer of aluminide; and a catalytic material disposed over thelayer of alumina, and comprising a step of passing a reactant into thecomplex microchannel and reacting the reactant in the complexmicrochannel to form at least one product; or (b) wherein the reactor orseparator is a separator and comprising a step of passing a fluidcomprising at least two components into the complex microchannel,preferentially separating at least one of the at least two componentswithin the complex microchannel.
 7. A microchannel reactor or separator,comprising: a microchannel defined by at least one microchannel wall;and a post-assembly coating of aluminide disposed over the at least onemicrochannel wall.
 8. The microchannel reactor or separator of claim 7,further comprising: a layer alumina disposed over the layer ofaluminide; and a catalytic material disposed over the layer of alumina.9. The microchannel reactor or separator of claim 8 comprising at leasttwo parallel microchannels connected to a manifold, wherein each of theat least two parallel microchannels comprise at least one microchannelwall; and a post-assembly coating of aluminide disposed over the atleast one microchannel wall.
 10. A method of conducting a chemicalreaction in the microchannel reactor or separator of claim 8,comprising: wherein the reactor or separator is a reactor and thereactor further comprises a a catalytic material disposed over the layerof alumina, and comprising a step of passing a reactant into the complexmicrochannel and reacting the reactant in the microchannel to form atleast one product.
 11. A method of forming a catalyst, comprising:adding a sintering aid to alumina to form an article with an aluminalayer with sintering aid; and heating the article with an alumina layerwith sintering aid; and subsequently depositing a catalyst material. 12.Microchannel apparatus, comprising: at least two parallel microchannels,each of which is contiguous for at least 1 cm; a manifold connecting theat least two microchannels; wherein the manifold comprises an aluminidecoating.
 13. A method of forming protected surfaces, comprising:providing an article comprising an aluminide surface; heating thearticle comprising an aluminide surface to at least about 800° C. in aninert or reducing atmosphere; and exposing the aluminde surface to anoxidizing gas at a temperature of at least about 800° C. to grow anoxide layer.
 14. The method of claim 13 comprsing heating the articlecomprising an aluminide surface to at least about 1000° C.; and exposingthe aluminde surface to an oxidizing gas at a temperature of at leastabout 1000° C. to grow an oxide layer.
 15. The method of claim 13comprsing heating the article comprising an aluminide surface to 1000 to1100° C.; and exposing the aluminde surface to an oxidizing gas at atemperature of 1000 to 1100° C. to grow an oxide layer.